💧 Flip-Chip Underfill: Capillary Flow, Washburn Law and Gel Time (2D)

Side view of a flip-chip die on a substrate, with liquid underfill resin creeping into the gap between the solder bumps by capillary action. Set the gap, the distance to fill, the surface tension, the contact angle, the viscosity and its temperature dependence, the bump pitch and size, and the cure activation energy, and see the fill time, the gel time and the margin between them. The Washburn law, the plate flow profile, the capillary pressure and the size scaling are checked numerically, with four in-page numerical checks.

2D · HTML5 Canvas 2D · 60 FPS target · runs fully client-side, no install