🔬 Flip-Chip Solder Bump: Thermal Cycling, Coffin-Manson Life and Weibull Spread (2D)

Cross-section of a flip-chip die on its substrate, with solder bumps sheared by the different thermal expansion of silicon and the board as the temperature cycles. Set the temperature extremes, die size, bump height, substrate expansion, dwell time, underfill relief and Weibull shape, and see the shear strain range, the cycles to failure and the spread of failures. Strain geometry, the strain-life law, a Weibull Monte Carlo and the scaling laws are checked numerically, with four in-page numerical checks.