Each feedstock block travels down the line and must clear two independent physical hurdles before it ships:
1. Thermal docking (Arrhenius kinetics). At the bonding station, a block only fuses to the lattice if it clears an activation barrier Ea within its residence time tres = (station length)/(line speed):
k = ν·exp(−Eₐ / kBT)
P(dock) = 1 − exp(−k·t_res)
with ν = 10¹³ s⁻¹ (a typical lattice attempt frequency) and Ea = 0.6 eV. This is why nanoscale self-assembly is so temperature-sensitive: a modest change in T swings the bonding rate by orders of magnitude, and a faster line leaves less residence time to bond at all.
2. Quantum tunneling defects (WKB approximation). Independently of temperature, a particle can tunnel through the fabrication barrier instead of following the intended classical path, silently corrupting the lattice position:
κ = √(2m·ΔV) / ħ
P(tunnel) ≈ exp(−2κL)
with barrier height ΔV = 1 eV fixed and barrier width L exposed as a slider — shrink L and the exponential penalty collapses, so thinner features are exponentially more defect-prone.
3. Entangled-sensor error correction. A correlated sensor pair downstream measures each unit; because the pair shares an entangled reference state, a flagged defect is caught with the scan-efficiency probability you set, and a repair arm pulls it for rework. Anything it misses ships as a hidden defect and costs yield instead of throughput.
- Temperature — raises P(dock) sharply above ~350 K; too hot with a fast line just means everything bonds but you are shipping faster, unfixed defects and all.
- Barrier width — the tunneling defect injection rate; below ~0.3 nm defects become common.
- Scan efficiency — the fraction of defects the entangled sensor pair actually catches before shipping.
- Conveyor speed — trades throughput against docking residence time.