The architecture
of precision.

Advanced semiconductor packaging campus · Integrated production, material flow and testing infrastructure.

LOD 01 / CAMPUS0 MODULES0 DRAWS

DRAG TO ORBIT
SCROLL TO ZOOM · SHIFT+DRAG TO PAN

PRODUCTION TELEMETRY● LIVE

GOOD UNITS / HR

—

EXPECTED THROUGHPUT↗

FIRST-PASS YIELD

—

SIMULATED◇

PLANT POWER

—

MW TOTAL LOADϟ

EQUIPMENT USE

—

ALL TOOL CLUSTERS◉

OUTPUT VELOCITYGOOD UNITS / HR

OPERATIONS CONTROLTUNABLE

Production line speed100%

40% · CONSERVATIVE160% · BOOST

Placement accuracy1.6 µm

0.6 µm5.0 µm

Particle concentration24 / m³

ULTRACLEANDEGRADED

Process cooling setpoint19 °C

15 °C30 °C

Thermal test chamber85 °C

−55 °C / COLD150 °C / HOT

Robotic transportAUTONOMOUS ENABLED

PRODUCTION WORKFLOW6 STAGES

CONTROLLED ENVIRONMENTLIVE

HUMIDITY—

ROBOT ARMS—

THERMAL TEST—

WIP INVENTORY—

FABRIX-240 · SYNTHETIC ENGINEERING MODEL
Illustrative simulation. Not a qualified semiconductor process specification.

The architectureof precision.