01 / OPERATOR CONSOLE● CONNECTED

Precision at scale.

Explore a 2.16 km² semiconductor packaging complex, from a production hall to individual microscopic interconnects.

EXPLORATION MODE SELECT A VIEW

PROCESS PARAMETERS LIVE CONTROL

Line speed 1.2×Capacity multiplier

Airborne particles 38 /m³Illustrative contamination load

Bond-head setpoint 245°CFlip-chip thermal bonding

Burn-in chamber 125°CElevated-temperature testing

Precision calibration 97%Alignment / maintenance condition

Plant cooling power 92%Chiller / HVAC performance

DRAG TO ORBIT · SCROLL TO ZOOM · SHIFT+DRAG TO PAN

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VIEWPORT / OVERVIEWHyperion advanced packaging campus1,800 × 1,200 M · 12 SECTORS · 1,152 PROCESS STATIONS

03 / MANUFACTURING SEQUENCE12 SEGMENTS · CLICK TO INSPECT

PROCEDURAL GEOMETRY · OFFLINE WEBGL2 · ILLUSTRATIVE PHYSICAL MODELS